[후공정]CMP
? Polishing Plate(table)
-Plate : 18inch dia Stainless steel Ø457×Ø160 x 45mmt
-평면도 : 0 - 3um 이내 ,Run out : 10um 이내
-Plate R.P.M. : 20 ~ 150 R.P.M
-Water Cooling Plate System
? Polishing Head (Vacuum type)
-Diameter : ø165
-Material : Stainless steel
-Speed : 10 - 80rpm
-Pressure : 5-300gram/cm2 for 4" & 6" wafer variable air pressure eletronic controller
? Process : 5 step process (rpm, pressure, time, slurry ,DI )
-Multi recipe : 10 recipe process
-Ceramic work carrier 4" & 6" wafer
? Slurry pump
-pump : roller pump
-Nozzles : Silicone tube
-Flow Rate : Max 50 ml/min , Slurry tube post
? New type Oscillation (Bridge type )
-Bridge type Oscillation and Diamond dressing system
-Nylon Brush for Pad Cleaning and Di Water Rinse
-Diameter : ø180mm ( 0.5mm brush, 10mm )
-R.P.M. : 10 - 80
-Dressing Mode By Recipe : table rpm, head rpm, di ,weight ,time
? Control
-Control : Touth & PLC + Programma
? Main
-Main Motor Drive : 2.2kW, 220V, 3 P
-Slow Start & Slow Stop Function
-Machine Weight : 1,600Kg
-Machine Dimension(W×D×H) : 1,100ⅹ1,600ⅹ2,000mmh