특징

1) Operating Bit rate : 100M to 12.5 Gbps

2) Pattern
-Pseudorandom binary sequence pattern
-Pattern : 2n- 1 (n: 7 9 11 15 20 23 31)
-Mark ratio : 1/2 1/4 1/8 0/8 (3/4 7/8 8/8 are possible with logic inversion)
-Data pattern length : 2 to 134217728 bits/ch
-Sequence Pattern-BLOCK Count : 1 to 128
-Block length: 8192 to 1048576 bits Steps:128bits
-Loop count :1to1024times Repeat
-Block Transition Conditions: A pattern match B pattern match Manual
Loop Time complete External trigger (rising edge)
-Next destination : Specified Block No or Stop

3) Data output
- Number of Outputs : 2(Data/Data)
- Amplitude : 0.25 to 2.5Vp-p
- Offset voltage : VoH : -2 to +3.3V 1mV steps
- Rise/fall time : ≤28ps(20% to 80%) typical
- Pattern jitter : ?10ps max.
- Load impedance : 50 ohm
- Connector : SMA or K
- Phase setting range: -1 to +1UI steps: 1mUI

4) Clock output
- Number of outputs : 22(Clock/Clock)
- Amplitude : 0.25V to 0.9V max.
- Rise/fall time : ≤30ps(20% to 80% of amplitude) tipical
- Connector : SMA or K

? Maxixmum voltage : 2000V 가능,
? Maximum current : 50A 측정 가능,
? Resolution : 0.1nA and 0.1mV,
? standard curves : MOSFET, IGBT, Diode, Zener, Triac 측정 가능

? S-parameter measurement
- Device : Compound device CMOS 3-port device
- Frequency available : ≥60GHz 100GHz upgradable
? Measurement in frequency and time domain
? DC parameter analyzing (-1A)
? Noise figure measure and modeling (~ 26GHz)
? Dynamic range : ≥70dB @ 5GHz
? Phase noise : -70dB @ 10GHz (10GHz offset)
? Noise floor : ≤-95dBm @ 5GHz

? Electron Optics
-Electron column : TriglavTM
-Electron Gun : High brightness Schottky emitter
-Resolution : 0.6 nm at 15 keV (In Beam SE), 0.9 nm at 1 keV (BD mode)
-Probe Current : < 2 pA to 400 nA
-Electron Beam Energy : 50 eV to 30 keV
? Chamber
-Dimensions : Internal dimensions: 340 mm (width) x 315 mm (depth),
-Door: 340 mm (width) x 320 mm (height)
-Chamber Vacuum: High vacuum : < 9 ×10-3 Pa
-SEM Gun Vacuum: < 3 x 10-7 Pa
-pumping time after specimen exchange typically < 3,5 minutes
-Stage Movements : X = 130 mm (- 65 mm to + 65 mm), Y = 130 mm (- 65 mm to + 65 mm), Z = 90 mm, Tilt = ?60° to +90°, Rotation : 360°
? Detectors Specifications
-SE Detector : Everhart-Thornley type
-In-Beam SE detector : Located in the SEM column
-Mid-Angle BSE detector : Second in-column detector
-LE-BSE detector mot. : scintillator type
-In-Beam f-BSE : scintillator-based back-scattered electron detector mounted in-column
-Beam Deceleration Technology(BDT) mode : Energy range is extended down to 50 eV
? Energy Dispersive X-ray Spectrometer
-NEW Bruker Energy Dispersive X- ray Spectrometer QUANTAX 200
-LN2-free high-speed Detector XFlash® 6
? Lithography System
-Elphy Quantum lithography system compatibility

.

? Sheet resistance measurement
- Measuring method : Contacted by 4-point probe
- Measuring range : 1 mohm/sq ∼ 2 Mohm/sq
- Measuring point : Center 1 point
? Resistivity measurement
- Measuring method : Contacted by 4-point probe (Input thickness)
- Measuring range : 10.0 μohm·cm ∼ 200.0 kohm·cm (VLSI standard wafer)
- Measuring point : Center 1 point
? Current source
- 10nA to 100mA
- DVM 0V to 2,000mV
? Measurement accuracy
- ±0.5 % (Precision resistor)
? JANDEL 4-point probe
- Pin spacing : 20 mils ∼ 50 mils
- Pin load : 10 gram/pin ∼ 250 gram/pin
- Pin radius : 12.5 micron ~ 500 micron