Lapping/Polishing
-공작물의 표면과 랩 과의 사이에 랩재나 공작액을 가하여 공작물 표면의 조도를 일정하게 하여 거울과 같은 면을 얻는 장치
-2~4단의 속도가변 영역을 설정하여 단일회전속도 설정에서 해낼 수 없었던 표면조도 형성
-Wafer size ; 2” ~ 8”

특징
Quarter 2 4 Porous Vaccum Microscope x0.8 ~ x5zoom Air Pulse 하중인가방식
1) Wafer table
- Size: Diameter 110mm (Porous Vacuum 100mm)
- Parallelism: ±10μm/100m
2) X-axis (Direction of pitch sending)
- Driving Method: Pulse motor & Lead screw
- Stroke: 0~100mm
- Resolution: 0.1μm
3) Y-axis (Work direction)
- Driving Method: AC Motor & Crankshaft
- Stroke: 25~110mm (Fixation within this range)
- Speed: 0~100mm/sec
4) Z-axis
- Driving Method: Pulse motor & Lead screw
- Stroke: 0~15mm
- Resolution: 1μm
5) θ -axis
- Driving Method: AC Motor & Timing Belt
- Operation Range: ±360°
- Resolution: 0.1°
6) Load axis
- Driving Method: Electrical Air Regulator & Air Cylinder
- Operation Range: 0~200g
- Resolution: Appro x 1g
7) Camera axis
- Driving Method: Pulse Motor & Ball Screw
- Operation Range: 0~99mm
8) Manual setting
- X-axis (Feeding Direction): Fine Adjustment
- Scribing Angle: ±3°