[Thin film] DC Sputtering System
1. Process
? Thin film co-sputtering deposition
? Deposition metal : Metal, Al, W, Pt, Etc
? Substrate Size : 4 inch single wafer
2.Depostion method
? Magnetron sputtering deposition : 3 inch target
? Dc power : 0 ~ 1,000 W
? Source gas : Ar
3.Performance
? Base pressure : 8 x 10E-7 torr
? Throughput : 1 sheet/ batch
? Thickness uniformity : ≤± 3%
? Manual operation by PLC